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Total: 85
Page 1 of 9
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Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Paper presents a print verification technology that captures the full board image, analyzes the data and accepts or rejects the print.
Channel: Assembly, Printing, Pick & Place
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This case study is a comprehensive blind study to determine removability with DI-water versus various chemistry supported systems.
Channel: Cleaning, Washing, Solvents
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Paper covers assembly and material alternatives to make a handheld products as producer friendly, cost effective and reliable as possible.
Channel: Assembly, Printing, Pick & Place
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Learn about the role of automatic inspections, SPI data mining, typical SMT process defects, and more in this presentation by Chrys Shea, Christopher Associates.
Channel: Test, Inspection, X-Ray
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Paper covers evaluation of cleaning effectiveness of chemistries in removing flux residues from beneath low standoff height components.
Channel: Cleaning, Washing, Solvents
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This paper presents a new generation N2 inerting system for wave soldering to make the technology more cost effective and user friendly.
Channel: Soldering, Selective, Wave
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Paper covers recommended materials and the hot gas rework process for lead-free BGAs with a mirrored configuration.
Channel: Rework, Repair, Modification
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This program explains four techniques for removing solder mask including grinding, milling, chemical stripping, and micro-blasting.
Channel: Adhesives, Coating, Dispensing
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Many companies have not found the right solutions to change over to lead free yet. Vapor phase reflow soldering can be an answer.
Channel: Reflow Soldering, Profiling
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Paper examines some of the solderless assembly methods used over the years, and looks forward at some solutions that might lie in the future.
Channel: Assembly, Printing, Pick & Place
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Total: 85
Page 1 of 9
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