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May 22, 2013
Assembly Challenges of Bottom Terminated Components
Jumper Wire Nightmare!
Touch Screen Assembly Using Adhesives
Selective Soldering Technology Selection
What is the Reliability of Reballed BGAs?
Collaborative Cleaning Innovations
Nitrogen Inerting For Lead-Free Wave Soldering
Integrated Electrical Test Within the Production Line
PCB Design Starts in the Cad Library
BGA Site Modification - Is It Possible?
Challenges for Step Stencil Printing
PCB Assembly System Set-Up for PoP
Low-Silver BGA Assembly
Revolutionary Printing Solution for SMT Assembly
Problem Areas for Selective Conformal Coating
Boundary Scan Advanced Diagnostic Methods
Cleaning to Enhance Product Reliability
Effect of Nano-Coated Stencil on 01005 Printing
Stencil Printing: Circular vs. Square Apertures
Advanced Rework Technology for Large Area Arrays
Effect of Clamping Systems on Print Quality
iNEMI Lead-free Wave Soldering Project
Stencil Printing Process Tools for Miniaturization
Stencil Printing for CSP's and 01005 Chips
Minimizing Voiding in QFN Packages
Assembly of Fine Pitch PoP Components
Tombstone Chip Caps Revisited
What Causes Solder Mask Outgassing?
Soldering Improvement for SMT Connectors
Control for Cost-Effective Selective Soldering
Mechanical Stress and PCB Depaneling
Dross Elimination and Prevention
Effect of Cooling Rate on the Intermetallic Solder Joints
Why LGA/QFN Packages May Float During Reflow
Effective Test-Probe Assignment
Estimating Stencil Life
Component Misplacement Prevention on Tape & Reel
One Big Cause of Assembly Problems
Dip Solder Paste for BGA Rework
Design and Construction Affects on PWB Reliability
Total: 124    Page 1 of 13 
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Bottom terminated components offer low cost and good functional performance. However, they create challenges for the assembly process. This paper discusses the design, assembly and inspection challenges of bottom terminated components.
Channel: Assembly, Printing, Pick & Place
Jumper Wire Nightmare!
Jumper Wire Nightmare!
A routing miscommunication resulted in a significant problem. The circuit traces for 2 adjacent connectors on a circuit board were switched. What was the solution?
Channel: Rework, Repair, Modification
Touch Screen Assembly Using Adhesives
Touch Screen Assembly Using Adhesives
Paper covers a novel anisotropic conductive film bonding process using ultrasonic vibration for touch screen panel applications.
Channel: Adhesives, Coating, Dispensing
Selective Soldering Technology Selection
Selective Soldering Technology Selection
Paper describes the evaluation process of selecting technology for selective soldering and which platform will best fit for the product application.
Channel: Soldering, Selective, Wave
What is the Reliability of Reballed BGAs?
What is the Reliability of Reballed BGAs?
Will the process of re-balling lead-free BGA components with tin-lead solder balls yield quality connections better or worse than soldering those components using tin-lead solder paste?
Channel: Rework, Repair, Modification
Collaborative Cleaning Innovations
Collaborative Cleaning Innovations
We'll cover how collaboration from equipment and cleaning material companies has led to innovations for improving throughput and residue removal under low standoff components.
Channel: Cleaning, Washing, Solvents
Nitrogen Inerting For Lead-Free Wave Soldering
Nitrogen Inerting For Lead-Free Wave Soldering
This paper presents a new generation N2 inerting system for wave soldering to make the technology more cost effective and user friendly.
Channel: Soldering, Selective, Wave
Integrated Electrical Test Within the Production Line
Integrated Electrical Test Within the Production Line
This paper discusses the advantages of a universal integrated electrical test solution, at the normal in-circuit test stage of production, to minimize production costs and help improve product quality.
Channel: Test, Inspection, X-Ray
PCB Design Starts in the Cad Library
PCB Design Starts in the Cad Library
Paper describes aspects to consider when creating chip CAD library parts and the impact that each feature has in the PCB process.
Channel: PC Fab, Board Design, Laminates
BGA Site Modification - Is It Possible?
BGA Site Modification - Is It Possible?
Here we cover a type of BGA site modification that uses a section of circuit track and a jumper wire to complete the modification.
Channel: Rework, Repair, Modification
Total: 124    Page 1 of 13 
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