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Total: 81
Page 1 of 9
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Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
| Low Surface Energy Coatings, Rewrites the Area Ratio Rules |
This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Channel: Assembly, Printing, Pick & Place
|
| Improve Etching Performance |
This paper discusses a new technology to improve etching performance using shiny side surface treatment on copper foil.
Channel: PC Fab, Board Design, Laminates
|
| Advances in Conductive Inks Across Multiple Applications |
In this paper the authors review both traditional and emerging applications for printed electronics, with a focus on the printed functional materials.
Channel: PC Fab, Board Design, Laminates
|
| Printable Materials for Electronic Packaging |
This paper reports on novel printable materials that have the potential to surpass conventional materials.
Channel: PC Fab, Board Design, Laminates
|
| Insulation Resistance of Dielectric Materials |
The investigation involves measuring the leakage current within internal PCB layers insitu during exposure of various specimens to a controlled ground-based test environment and a simulated space environment.
Channel: PC Fab, Board Design, Laminates
|
| Comparison of SAC105 and SAC305 Solders |
In this paper, the thermal fatigue performance under accelerated test conditions is compared for three common BGA ball alloys.
Channel: Solders, Fluxes, Pastes
|
| Pad Cratering Evaluation of PCBs |
This paper reviews major publications and research reports with regard to pad cratering on various PCB materials.
Channel: Contamination, Defects, Whiskers
|
| Conformal Coating for Tin Whisker Management |
The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth.
Channel: Adhesives, Coating, Dispensing
|
| Gold Stud Bump Flip Chip Attachment |
Flip chip bonding is a desirable attachment approach for minimizing size. This paper compares immersion and auto catalytic gold plating processes for flip chip bonding.
Channel: Flip-Chip, MEMS, Semiconductors
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| Board Performance after Pb-Free Reflow |
This paper will focus on air-air thermal cycling, IST testing and material survivability after lead-free assembly reflow.
Channel: PC Fab, Board Design, Laminates
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Total: 81
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