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Total: 65
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Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
This paper reports on novel printable materials that have the potential to surpass conventional materials.
Channel: PC Fab, Board Design, Laminates
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Paper describes use of organic metal finish deposited onto copper pads to provide protection against oxidation and preserve solderability.
Channel: PC Fab, Board Design, Laminates
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The paper addresses the issue of underfill as die thickness diminishes, the interconnection bumps get smaller and their number increases.
Channel: Adhesives, Coating, Dispensing
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This paper discusses the strategy and methodology for selecting a good lead-free solder paste material for volume manufacturing uses.
Channel: Solders, Fluxes, Pastes
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Paper discusses best practice for lead-free HASL lines and the properties expected with a properly applied HASL finish.
Channel: PC Fab, Board Design, Laminates
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Paper shows different approaches to use ultra-thin chips for new packages with high density and improved performance.
Channel: Flip-Chip, MEMS, Semiconductors
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Paper outlines a new technology with a focus on design and research involved in the development of a new solder attach technology.
Channel: Soldering, Selective, Wave
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This paper highlights some of the differences between traditional solder pastes and PoP solder pastes.
Channel: Solders, Fluxes, Pastes
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This paper discusses a process for creating a digital solder paste using quantitative benchmarking techniques.
Channel: Solders, Fluxes, Pastes
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Paper covers an investigation that a two year shelf life recommendation is unnecessarily conservative for flux cored wire solder.
Channel: Solders, Fluxes, Pastes
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Total: 65
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