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Joint Industry Guideline Reduces the Stress of Setting up Strain Gauge Tests
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| IPC/JEDEC-9704A, Printed Circuit Assembly Strain Gage Test Guideline, makes it easier for users to measure manufacturing strain on printed board assemblies.
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Tax Reform -- It's Coming
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| Keith Smith, Prime Policy Group, discusses the tax outlook for 2012, in an upcoming webinar.
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Deadline for New TSCA Reporting Requirements is June 30
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| If you send spent bath, etching solutions or waste water treatment sludge for recycling, you may be subject to a June 30 reporting deadline under EPA's new Toxic Substances Control Act (TSCA).
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4 Weeks Until the IPC Conference on Flexible Circuits
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| Nick Koop, Product Manager, Minco Products, Inc. discusses the importance of attending the IPC Conference on Flexible Circuits.
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Deadline for On-shoring Survey is May 25
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| Attention electronics manufacturers and suppliers: only a few days left to participate in IPC's "fast facts" survey about on-shoring in the Americas.
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IPC Releases Study on Quality Benchmarks for EMS Industry
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| IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2011 is now available.
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IPC Midwest Spotlights Solutions to Reliability Challenges in Electronics Manufacturing
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| IPC Midwest will highlight new technologies, materials and processes in electronics manufacturing to help engineers work smarter.
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Tell Congress to Amend Federal Travel Restrictions -- An Update
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| Obama Administration responds with directive to federal agencies.
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Recommended handling techniques to prevent moisture related component malfunctions during electronics assembly.
Free Review
May 21, 2012
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Industry-approved repair techniques for electronic assemblies, including evaluation criteria.
Free Review
May 14, 2012
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Teach your operators electronics assembly and wiring documentation in an easy to understand format.
Free Review
May 7, 2012
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Demonstrates the industry standard eyelet repair procedure for a damaged plated-through hole as described in IPC-7721.
Free Review
April 30, 2012
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Explains the most common inspection errors that occur during electronics assembly to help prevent defects.
Free Review
April 23, 2012
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State-of-the-art procedures for lead free drag soldering, ultra small chips, center ground (DPAKs and BTCs), heavy thermal mass components, and BGA site prep.
Free Review
April 16, 2012
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As new generations of integrated circuits (ICs) become more sensitive to electrostatic discharge, ESD continues to be one of the most pernicious problems facing the electronics industry. Education is essential to prevent costly failures and expensive rework.
Free Review
April 9, 2012
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Details the basics of through-hole hand soldering, from operator safety through solder joint acceptance criteria, using tin-lead solder.
Free Review
April 2, 2012
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Resolve your most challenging hand soldering problems and prevent bad habits before they start.
Free Review
March 26, 2012
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Industry-approved rework techniques for solder defects on tin-lead and lead-free assemblies.
Free Review
March 19, 2012
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Explains the basics of through-hole hand soldering, from operator safety through solder joint acceptance criteria, using lead-free solder.
Free Review
March 12, 2012
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A visual introduction to wire harness manufacturing process.
Free Review
March 5, 2012
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Focuses on seven major problem areas during SMT assembly, explaining potential problems and typical causes.
Free Review
February 27, 2012
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Designed to help prevent handling defects and reduce scrap.
Free Review
February 20, 2012
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Best-practices for soldering wires to common terminals, including: turret, cup, bifurcated, hook and pierced terminals.
Free Review
February 13, 2012
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With tips costing from $10 to over $100, this IPC training video can reduce the cost of process consumables and increase product quality.
Free Review
February 6, 2012
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Today's Sponsor
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IPC Member Spotlight
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New High-speed Modular Chip-shooter
The FX3 is a new high-speed modular chip-shooter delivering cutting edge technology combining speed, performance and high-uptime.
Juki Automation Systems
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Featured Sponsors
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PCBs are MSDs
IPC-1601 PCB Guidelines state, "board fabricators and users should strive to avoid baking by practicing effective handling, packaging, storage, and process controls..." Learn how ...
Super Dry
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The Design Process Just Got Easier
Sunstone Circuits, has released the newest version of their design software, PCB123. Bottom line, the design process just got easier.
Sunstone Circuits
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IPC Training & Certification from Blackfox
Experience the Blackfox difference! Schedule your IPC Training and Certification with Blackfox at one of our many certification sites, or we'll come to you. Find the schedule...
Blackfox Training Institute
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Lead-free Compatible Selective Soldering
The FlexSolder W510 Selective Soldering System is a low cost, lead-free compatible, superior-quality system, offering high flexibility.
Juki Automation Systems
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Complete and Versatile Circuit Board Repair Kit
If you need to repair damaged circuit boards, the all in one Professional Repair Kit is what you need. It's the total package.
CircuitMedic
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A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
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