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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
May 21, 2012
Joint Industry Guideline Reduces the Stress of Setting up Strain Gauge Tests
Joint Industry Guideline Reduces the Stress of Setting up Strain Gauge Tests
IPC/JEDEC-9704A, Printed Circuit Assembly Strain Gage Test Guideline, makes it easier for users to measure manufacturing strain on printed board assemblies.
Tax Reform -- It's Coming
Tax Reform -- It's Coming
Keith Smith, Prime Policy Group, discusses the tax outlook for 2012, in an upcoming webinar.
Deadline for New TSCA Reporting Requirements is June 30
Deadline for New TSCA Reporting Requirements is June 30
If you send spent bath, etching solutions or waste water treatment sludge for recycling, you may be subject to a June 30 reporting deadline under EPA's new Toxic Substances Control Act (TSCA).
4 Weeks Until the IPC Conference on Flexible Circuits
4 Weeks Until the IPC Conference on Flexible Circuits
Nick Koop, Product Manager, Minco Products, Inc. discusses the importance of attending the IPC Conference on Flexible Circuits.
Deadline for On-shoring Survey is May 25
Deadline for On-shoring Survey is May 25
Attention electronics manufacturers and suppliers: only a few days left to participate in IPC's "fast facts" survey about on-shoring in the Americas.
IPC Releases Study on Quality Benchmarks for EMS Industry
IPC Releases Study on Quality Benchmarks for EMS Industry
IPC Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2011 is now available.
IPC Midwest Spotlights Solutions to Reliability Challenges in Electronics Manufacturing
IPC Midwest Spotlights Solutions to Reliability Challenges in Electronics Manufacturing
IPC Midwest will highlight new technologies, materials and processes in electronics manufacturing to help engineers work smarter.
Tell Congress to Amend Federal Travel Restrictions -- An Update
Obama Administration responds with directive to federal agencies.
IPC Calendar   »
June 6 - Webinar
Business Outlook for the Electronics Industry: Mid-year Update
June 12-14 - Conference
IPC Conference on Flex Circuits
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Handling Moisture Sensitive Devices
Recommended handling techniques to prevent moisture related component malfunctions during electronics assembly.

Free Review May 21, 2012
Land and Conductor Repair for Electronics Assembly
Industry-approved repair techniques for electronic assemblies, including evaluation criteria.

Free Review May 14, 2012
Print Reading for Electronics Assembly
Teach your operators electronics assembly and wiring documentation in an easy to understand format.

Free Review May 7, 2012
Plated-Through Hole Repair
Demonstrates the industry standard eyelet repair procedure for a damaged plated-through hole as described in IPC-7721.

Free Review April 30, 2012
IPC-A-610E Common Inspection Errors
Explains the most common inspection errors that occur during electronics assembly to help prevent defects.

Free Review April 23, 2012
Advanced Hand Soldering Techniques
State-of-the-art procedures for lead free drag soldering, ultra small chips, center ground (DPAKs and BTCs), heavy thermal mass components, and BGA site prep.

Free Review April 16, 2012
ESD Control for Electronics Assembly
As new generations of integrated circuits (ICs) become more sensitive to electrostatic discharge, ESD continues to be one of the most pernicious problems facing the electronics industry. Education is essential to prevent costly failures and expensive rework.

Free Review April 9, 2012
Hand Soldering for Through-Hole Components  (Tin-Lead)
Details the basics of through-hole hand soldering, from operator safety through solder joint acceptance criteria, using tin-lead solder.

Free Review April 2, 2012
The Seven Sins of Surface Mount Soldering
Resolve your most challenging hand soldering problems and prevent bad habits before they start.

Free Review March 26, 2012
Through Hole Rework
Industry-approved rework techniques for solder defects on tin-lead and lead-free assemblies.

Free Review March 19, 2012
Lead Free Hand Soldering for Through-Hole Components
Explains the basics of through-hole hand soldering, from operator safety through solder joint acceptance criteria, using lead-free solder.

Free Review March 12, 2012
Wire Harness Assembly Methods
A visual introduction to wire harness manufacturing process.

Free Review March 5, 2012
The Seven Sins of Surface Mount Assembly
Focuses on seven major problem areas during SMT assembly, explaining potential problems and typical causes.

Free Review February 27, 2012
Handling in Electronics Assembly
Designed to help prevent handling defects and reduce scrap.

Free Review February 20, 2012
Soldering Terminals
Best-practices for soldering wires to common terminals, including: turret, cup, bifurcated, hook and pierced terminals.

Free Review February 13, 2012
Soldering Iron Tip Care
With tips costing from $10 to over $100, this IPC training video can reduce the cost of process consumables and increase product quality.

Free Review February 6, 2012
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Today's Sponsor
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IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
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Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
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