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The Knowledge and Know-how Connection
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June 19, 2013
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Total: 233
Page 1 of 24
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| A Generic Reflow Profile |
We have a wide mix of PCB assembly types. Some here propose that we use the same reflow profile regardless of the PCB thickness, thermal mass or component mix? Is there any justification for using one generic reflow profile?
Channel: Reflow Soldering, Profiling
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| Components Lifting During Wave Soldering |
We have a problem with components rising while going through wave soldering. We prefer to avoid lead clinching. What do you suggest?
Channel: Soldering, Selective, Wave
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| White Discoloration After Ultrasonic Cleaning |
We are using halogen free solder paste SAC305 type no clean. We are cleaning using an ultrasonic cleaning system. After cleaning there is a white discoloration on the soldered areas. What could be the cause?
Channel: Cleaning, Washing, Solvents
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| BGA Component Moisture Exposure |
We mistakenly assembled boards using BGA components with moisture tags that show indication of moisture exposure. Can we rebake the assemblies?
Channel: Baking, Ovens, Moisture Control
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| Toe Fillet Requirements on Gull Wing Components |
Is a toe fillet required on gull wing components? We have some gull wing components that have no toe fillet, but all the other requirements for the solder connection are met.
Channel: Soldering, Selective, Wave
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| Solder Paste Life on the Stencil |
Our solder paste has a specified life for exposure on the stencil at 10 hours. We run our stencil operation continuously for 40 hours, adding 250g of new paste every 2 hours. After the first 10 hours of manufacturing, do we need to remove all the paste on the stencil and scrap it?
Channel: Assembly, Printing, Pick & Place
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| What Causes Black Pad? |
What is the primary cause of Black Pad and/or pad contamination during the assembly process?
Channel: Contamination, Defects, Whiskers
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| Solder Paste Alloy Check |
We have a production line that runs mainly leaded paste. We accidentally assembled boards using lead-free paste and now we have mixed product. Is there any easy method to check which paste has been used?
Channel: Solders, Fluxes, Pastes
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| Gold Contact Flux Contamination Failures |
We have assemblies with visible contamination on the gold edge contacts and analysis confirmed it is flux residue. Can this residue cause functionality problems?
Channel: Contamination, Defects, Whiskers
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| Reflow Causing Warp |
We have a 20 layer PWB that bows during reflow. Other than a better design, what can be done prior to reflow, during reflow, or post reflow, to prevent the board from warping?
Channel: Reflow Soldering, Profiling
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Total: 233
Page 1 of 24
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