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Total: 105
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Board Talk programs are presented by:
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Prior to conformal coating, how long can we keep a circuit board assemblies in an open condition before they will be impacted by moisture absorption? Listen as the Assembly Brothers cover this topic.
Channel: Adhesives, Coating, Dispensing
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For either Type III or Type IV solder paste, should there be a minimum number of solder spheres deposited on each surface mount pad?
Channel: Assembly, Printing, Pick & Place
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How long do you expect the industry will continue to use through hole components? I can envision connectors being used for some time, but what about the other component types?
Channel: PC Fab, Board Design, Laminates
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We are wave soldering very close pitch through-hole components and see bridging. Is there anything you can recommend so we can reduce bridging on this component?
Channel: Soldering, Selective, Wave
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What would be the best method or product for cleaning bare PCBs that have a small amounts of oxidation? I know that proper storage and handling may solve the problem, but what would you suggest?
Channel: PC Fab, Board Design, Laminates
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Do circuit board assemblies need to be baked after routine aqueous cleaning? If so, how long and at what temperature?
Channel: Cleaning, Washing, Solvents
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We are experiencing poor wetting on one OSP coated PCB using a lead-free, no clean paste. We see this problem on just one board part number. Where should we look to solve this problem?
Channel: PC Fab, Board Design, Laminates
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What is the practical shelf life of a syringe of solder paste, and what symptoms would one see when the syringe is getting too old?
Channel: Solders, Fluxes, Pastes
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Is there a recommended usage rate for stencils? Is there a way to determine when it's time to replace a squeegee or a stencil?
Channel: Assembly, Printing, Pick & Place
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What can cause a 0603 passive component to blow off the circuit board during reflow as if a firecracker was put underneath?
Channel: Reflow Soldering, Profiling
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Total: 105
Page 1 of 11
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IPC Member Spotlight »
Ultimate Solution for Placement Flexibility
The Juki KE2080 flexible placement system successfully places the widest range of ICs, connectors, and unique shaped components on the market.
Juki Automation Systems, Inc.
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Featured Sponsors »
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A Century of Global Soldering Leadership
Why spend so much time developing profiles for every board, when Vitronics Soltec's Autoset can do it for you, automatically?
Vitronics Soltec
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APEX EXPO® Keynote William Shatner
Solve manufacturing challenges while networking with hundreds of exhibitors and thousands of peers focused on design, manufacture, assembly and test. Keynote by William Shatner.
IPC — Association Connecting Electronics Industries
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Surface Mount and BGA Pad Repair... Really?
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how we can do it reliably.
Circuit Technology Center
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Innovative No-clean, Halide-free Tacky Flux
Multicore TFN700B is a no-clean, halide-free tacky flux formulated to address the challenging requirements of package-on-package applications.
Henkel Corporation
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Perfect Kit for Replating Gold Contacts
There's simply no reason to scrap circuit boards when they have contacts contaminated with solder. Restore them using the Gold Contact Plating Kit.
CircuitMedic 
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