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Total: 135
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Board Talk is presented by ITM ConsultingVisit ITM Consulting to learn more.Phil Zarrow, ITM ConsultingWith over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes. Jim Hall, ITM ConsultingA Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
| Best Method for Repairing Underfill Arrays? |
***image1**2What is the best method for removing an SMT array package that has been under-filled and cured. Mechanically, thermally, chemically, a combination of these methods. Is there an industry approved method?
Channel: Rework, Repair, Modification
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| Is De-paneling PCBs by Hand Acceptable? |
Is it acceptable to hand break when de-panelizing circuit boards that contain QFN and SMD components? Are there specs for hand breaking?
Channel: Assembly, Printing, Pick & Place
|
| Is There a Thermal Cycle Limit? |
How many thermal cycles should we allow at a given location on a circuit board before we should consider the assembly compromised?
Channel: Rework, Repair, Modification
|
| Long Term Component Storage |
We need to store a variety of electronic SMD components for at least 10 years. What do you recommend for a humidity and temperature settings? Would these settings be different from typical short-term storage?
Channel: Operations, Productivity, Supply
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| Is There a Spacing Spec for SMD Components? |
Is there a general minimum spacing requirement or should we apply SMT components to comply with the majority of the SMT pick and place systems on the market?
Channel: Assembly, Printing, Pick & Place
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| How to Gauge Solder Paste Volume? |
How much solder paste should be applied when running a stencil printing system? Should you print a PWB on the first pass, or work the paste a few cycles before the first board?
Channel: Assembly, Printing, Pick & Place
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| Random Lifted Leads on QFP Components |
After placement and reflow, we have a random lifted lead problem on some QFPs. What might be the cause? Where should we look?
Channel: Reflow Soldering, Profiling
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| Sticky Residue Under Low Clearance Parts |
We are finding a tacky substance, the consistency of rubber cement, underneath a large surface mount component. Is this residue common when no-clean leaded solder paste is used with large, no clearance parts? What causes this?
Channel: Contamination, Defects, Whiskers
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| What is the Life Span of a Profile Board? |
What is the life span of a profile board? How many times can I use one test board to profile a reflow oven before throwing it away and why?
Channel: Reflow Soldering, Profiling
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| Can Water Harm Electronic Components? |
A new quality assurance engineer insists electronic components should not be cleaned with water. Can you enlighten us?
Channel: Cleaning, Washing, Solvents
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Total: 135
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