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Total: 115
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Board Talk programs are presented by:Phil Zarrow, ITM ConsultingWith over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes. Jim Hall, ITM ConsultingA Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
With today's newer chemistries, what are the pros and cons of cleaning circuit boards assembled using a no-clean process? The Assembly Brothers, Phil Zarrow and Jim Hall, let it pour.
Channel: Cleaning, Washing, Solvents
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I supervise no-clean, lead-free SMT lines in an area with no control over humidity. We are seeing a high fallout due to insufficient paste application on TSOP components. Help!
Channel: Reflow Soldering, Profiling
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One particular SMT component is popping off during the reflow process leaving indentations in the solder. Could the fans in our convection reflow oven be blowing the part of the PCB?
Channel: Rework, Repair, Modification
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I have immersion gold PCBs that have developed oxidation. Is there a specific material/process to recover these boards? There seems to be a disconnect here, can PCBs with immersion gold oxidize?
Channel: Contamination, Defects, Whiskers
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What is your opinion about using round versus square apertures for BGA patterns in solder paste stencils?
Channel: Assembly, Printing, Pick & Place
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If you remove a component from a circuit board, and the component is functional and not physically damaged, can it be reused on another circuit board?
Channel: Rework, Repair, Modification
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What is the best way to reduce dross? What are all the possible options to cut down on solder dross? The Assembly Brothers, Phil Zarrow and Jim Hall, offer some options.
Channel: Soldering, Selective, Wave
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What are the risks of mixing tin-lead and lead-free components on a board that does not have to be RoHS compliant?
Channel: Environment, RoHS, Recycling
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We have a circuit board assembly with a wafer level chip scale package. Under what circumstances should we use underfill? What type of underfill material do you suggest?
Channel: Flip-Chip, MEMS, Semiconductors
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We notice deflection in the 8x8 inch panel being populated. Will this deflection cause components to sit higher on the paste and thus have a slightly higher solder joint height?
Channel: Assembly, Printing, Pick & Place
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Total: 115
Page 1 of 12
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