|
|
|
|
Total: 70
Page 1 of 7
|
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
Paper covers high temperature life testing on embedded capacitors to precipitate failures as a result of defects in the composite dielectric.
Channel: PC Fab, Board Design, Laminates
|
Paper evaluates coating adhesion and solder joint reliability for assemblies with different conformal coatings, solder masks and underfill.
Channel: Adhesives, Coating, Dispensing
|
The head on pillow defect is becoming more common. This paper describes an occurrence for an OEM and explains how it was dealt with.
Channel: Contamination, Defects, Whiskers
|
In this paper, SAC305 solder balls were replaced with SnPb solder balls and tested to evaluate the reliability of these reballed components.
Channel: Rework, Repair, Modification
|
Paper covers misidentification of tin/copper intermetallic structures as tin whiskers and soldering details during root cause analysis.
Channel: Contamination, Defects, Whiskers
|
Study compares material compatibility and cleaning effectiveness of pH-neutral and alkaline technologies at low operating concentrations.
Channel: Cleaning, Washing, Solvents
|
This paper reports a number of experimentally determined reactions that occur in Sn-rich Cu-Sn-Zn alloy.
Channel: Solders, Fluxes, Pastes
|
Paper aims at analyzing and confirming the reliability performance of embedded components compared to that of standard SMT components.
Channel: PC Fab, Board Design, Laminates
|
This paper examines concerns relating to lead-free reflow, PCB degradation, and the influence of moisture absorption.
Channel: Reflow Soldering, Profiling
|
Paper establishes a test protocol for thermal cycle testing of bare PWBs exposed to lead-free and rework simulation.
Channel: Test, Inspection, X-Ray
|
|
|
Total: 70
Page 1 of 7
|
|
|
