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Total: 112
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Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
| The Effects of Flux Residues on Reliability |
Paper discusses an experiment designed to mimic partially activated flux residues under component bodies and how it affects SIR performance.
Channel: Contamination, Defects, Whiskers
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| Creep Corrosion of PWB Final Finishes |
This paper demonstrates that creep corrosion on a PWB is highly surface sensitive.
Channel: PC Fab, Board Design, Laminates
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| Best Practices - Reflow Profiling for Lead-free |
Paper covers best practices for optimizing the reflow process to meet challenges of higher temperatures, smaller deposits and decreased powder size.
Channel: Reflow Soldering, Profiling
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| EOS Exposure of Components in the Soldering Process |
This paper examines the nature; the consequences and the mitigation of electrical overstress caused by electromagnetic interference, or electrical noise, on power lines and ground in the manufacturing environment.
Channel: Soldering, Selective, Wave
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| Voiding Control at QFN Assembly |
Thermal pad voiding control at QFN assembly is a major challenge due to the large coverage area, large number of via, and low standoff.
Channel: Test, Inspection, X-Ray
|
| X-rays vs. Cross Sections to Measure Voids |
This paper validates void measurements obtained from non-destructive imaging techniques, with the physically measured void measurements of cross sectioning.
Channel: Test, Inspection, X-Ray
|
| Test Method to Characterize Pad Cratering |
In this study, an easy-to-implement test method to quantify the propensity for pad cratering in different PCB materials is presented.
Channel: Rework, Repair, Modification
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| Corrosive Driven Whisker Growth in SAC305 |
This paper reports a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth.
Channel: Contamination, Defects, Whiskers
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| Fatigue Behaviour of Reflowed Joints |
This paper explores the behaviour of a copper test vehicle with multiple reflowed solder joints, which has direct relevance to ball grid arrays and high density interconnect structures.
Channel: Test, Inspection, X-Ray
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| Evaluating Surface Cleanliness |
The water break test is easy and practical to conduct and helps you evaluate residues left from adhesives or conformal coating dots.
Channel: Test, Inspection, X-Ray
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Total: 112
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Circuit Technology Center 
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Heller Shanghai Celebrates 10 Year Anniversary
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Heller Industries Inc. 
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Counterfeit Component Certification
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EPTAC Corporation 
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Stencil Printer for 4-Ft LED Strips
1200 x 400 mm print area & screw-drive stencil separation for clean, sharp printing of LED strips. Full-vision automatic alignment option. See video.
Manncorp 
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Insignum - Laser Marking Systems
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ASYS Group Americas Inc. 
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Highly Flexible Pick-Place with 8-axis Placer
Cobra is the first inline machine to combine the advantages of a highly flexible pick-and-place with the speed of an 8-axis placer.
Essemtec 
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