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June 18, 2013
Programs  »
Solder Paste Transfer Efficiency - What/Why
High Capacity Wireless Data Transmission
A Generic Reflow Profile
Low Surface Energy Coatings, Rewrites the Area Ratio Rules
Pin in Paste Plus Preforms to Eliminate Wave Soldering
Increase Your Technical and Industry Knowledge
Increase Your Technical and Industry Knowledge
IPC India's National Conference on Electronics Design, Assembly and Reliability offers a technical conference, workshops, exhibition and PCB design and hand soldering competitions in Bangalore, India, December 4-6, 2012.


http://www.ipc.org/calendar/2012/NCEDAR/ncedar-email5.htm
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