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June 19, 2013
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Low Surface Energy Coatings, Rewrites the Area Ratio Rules
Pin in Paste Plus Preforms to Eliminate Wave Soldering
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
Solder Paste Transfer Efficiency - What/Why
High Capacity Wireless Data Transmission
IPC Standards Committee Reports
IPC Midwest committee reports on printed board design, data generation/transfer, electronic documentation and high speed/high frequency.
http://blog.ipc.org/2012/09/27/ipc-standards-committee-reports-printed-board-design-data-generationtransfer-electronic-documentation-high-speedhigh-frequency/
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Why Use EMI / RFI Shielding
EMI / RFI shielding products protect electronics from damaging electromagnetic radiation. Learn more...
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