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The Knowledge and Know-how Connection
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June 18, 2013
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Improve DPPM for Wave Soldering Using Nitrogen
To improve our DPPM level we plan to install a nitrogen environment around the wave soldering tank to reduce oxidation. Is this likely to improve our DPPM level?
Expert Panel contributors for this topic:
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Jerry Karp, President, JSK Associates | |
Greg York, Technical Sales Manager, BLT Circuit Services Ltd | |
Gregory Arslanian, Global Segment Manager, Air Products & Chemicals, Inc. | |
Gerard O'Brien, President, S T and S Testing and Analysis | |
Mahendra Gandhi, SME - PWB Technologies, Northrop Grumman | |
Fritz Byle, Process Engineer, Astronautics |
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Views: 553
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Dear Mr.Byle, when correctly using nitrogen for atmosphere inerting, the liquid solder surface tension will increase (not the opposite). Air oxygen molecules tend to brake the "elastic membrane" at liquid drop surface. With better surface tension, less solder is needed as well (better drop shape). The solder concentrates on the desired place and at the end less shorts and less bridges (less defects).
Luiz Felipe Rodrigues, Air Liquide, Brazil