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June 19, 2013
Ten Rules for Jumper Wires
Ten Rules for Jumper Wires
Production Floor
Overcoming Repair Depot Challenges
Overcoming Repair Depot Challenges
Production Floor
Jumper Wire Nightmare!
Jumper Wire Nightmare!
Production Floor
Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
Board Talk
Is There a Thermal Cycle Limit?
Is There a Thermal Cycle Limit?
Board Talk
Rework or Repair?
Rework or Repair?
Ask the Experts
What is the Reliability of Reballed BGAs?
What is the Reliability of Reballed BGAs?
Production Floor
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
Analysis Lab
BGA Site Modification - Is It Possible?
BGA Site Modification - Is It Possible?
Production Floor
BGA Rework Flux Recommendation
BGA Rework Flux Recommendation
Ask the Experts
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Rework for OSP Assemblies
Rework for OSP Assemblies
Should we modify any rework or repair procedures for circuit board assemblies fabricated using OSP (Organic Solderability Preservative) bare circuit boards?
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Greg York, Technical Sales Manager, BLT Circuit Services Ltd
Molly O'Hara, PCB Fabrication Expert, Sunstone Circuits
Fritz Byle, Process Engineer, Astronautics
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
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