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June 18, 2013
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Solder Paste Transfer Efficiency - What/Why
High Capacity Wireless Data Transmission
A Generic Reflow Profile
Low Surface Energy Coatings, Rewrites the Area Ratio Rules
Pin in Paste Plus Preforms to Eliminate Wave Soldering
Winners of IPC Midwest Hand Soldering Competition Announced
Sixteen competitors showed off their hand soldering skills during an action-packed competition at IPC Midwest Conference & Exhibition, but one emerged victorious.
http://www.ipc.org/ContentPage.aspx?pageid=Winners-of-IPC-Midwest-Hand-Soldering-Competition-Announced-2012
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Reduce ESD and MSD Issues with SensorWATCH
Discover what a factory-wide, fail-safe humidity and temperature monitoring system can do for your process and your peace of mind.
ECD
IPC — Association Connecting Electronics Industries
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Sandy Gentry, Editor | Neal Bender, Membership Director
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