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May 24, 2013
Voiding Control at QFN Assembly
Voiding Control at QFN Assembly
Analysis Lab
Integrated Electrical Test Within the Production Line
Integrated Electrical Test Within the Production Line
Production Floor
X-rays vs. Cross Sections to Measure Voids
X-rays vs. Cross Sections to Measure Voids
Analysis Lab
Fatigue Behaviour of Reflowed Joints
Fatigue Behaviour of Reflowed Joints
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Evaluating Surface Cleanliness
Evaluating Surface Cleanliness
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Boundary Scan Advanced Diagnostic Methods
Boundary Scan Advanced Diagnostic Methods
Production Floor
Pb-Free Thermal Cycle Acceleration Factors
Pb-Free Thermal Cycle Acceleration Factors
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Revolutionary Technique for Microvia Microsections
Revolutionary Technique for Microvia Microsections
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Explanation of PoP Inspection Techniques
Explanation of PoP Inspection Techniques
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Drop Test Performance of BGA Assemblies
Drop Test Performance of BGA Assemblies
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BGA Die and Pry Testing
BGA Die and Pry Testing
Are these results in the image Kirkendall Voiding or some other defect? The defect appears after 500 operating cycles on a batch of assemblies. Would you recommend that we rework the remaining assemblies?
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Expert Panel contributors for this topic:
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Fritz Byle, Process Engineer, Astronautics
Gerard O'Brien, President, S T and S Testing and Analysis
Lee Levine, President, Consultant, Process Solutions Consulting Inc.
Neil Poole, Senior Applications Chemist, Henkel Electronics
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