The first IPC standard that originated outside the U.S., IPC-7527, Requirements for Solder Paste Printing, is also the first standard ever developed that focuses on the application of one of the industry's most basic infrastructure elements, solder paste.
Master Bond EP30FL is a two part, flexibilized epoxy potting/encapsulant that has superior electrical insulation properties and resistance to impact. Master Bond Inc.
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director
