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May 24, 2013
Programs  »
Board Performance after Pb-Free Reflow
Soldering Multilayer Ceramic Chip Capacitor
Jumper Wire Nightmare!
Denial in the Electronics Industry = Disaster
What is Next for the Chinese Economy?
Handbook Encapsulates a Wealth of Information on Protective Coatings
Handbook Encapsulates a Wealth of Information on Protective Coatings
IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly, is being described as a cookbook for potting and encapsulants.


http://www.ipc.org/feature-article.aspx?aid=A-cookbook-for-potting-and-encapsulants
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