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Accurate Force Measurement SolderabilityTesting
Force measurement solderability testing verifies the robustness of the component or board termination. The Gen 3 Systems Must 3 measures forces at milli-newton levels accurately and easily.
Gen3 Systems Limited
Tips for Rework of Large Scale BGA Components
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
|Faster, Easier & Smarter Jetting
The Genius™ Jet Cartridge is the next generation in jet dispensing. The one-piece Jet Cartridge is easily removed & lowers cost-of-ownership by 20%. Learn More ...
|IPC Certification Near You
We may be closer than you think! Train with the leading provider of IPC Certification this year. On-site or throughout US and Canada. All IPC Programs, Solder Training and more ...
|Moisture Damage Causes Early Field Failures
All components are susceptible to moisture damage. Even PCBs. These defects can pass through ICT and functional test and they lead to early field failures. Is your CM in control of MSDs?
Super Dry® by Totech
|A World of Selective Soldering Solutions
Vitronics Soltec's selective soldering machines exceed customers' expectations. Varitron Technologies says their 6746 "is practical and backed 100%!"
|Benefits of Electrolytic Solder
The electrolytic process creates bar solder of higher purity lower viscosity, surface tension, & greater fluidity. Reduce Dross Generation & Defects up to 30%.
Metallic Resources, Inc.