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The Knowledge and Know-how Connection
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May 17, 2013
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We have been experiencing delamination causing scrap. Is there a way to definitively determine that the delamination is being caused by moisture vs. some other type of defect? Is it possible to repair delamination in printed board assemblies?
Expert Panel contributors for this topic:
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Bob Lazzara, VP, Marketing & Tech Support, Circuit Connect, Inc. | |
Mark Finstad, Senior Applications Engineer, Flexible Circuit Technologies | |
Bhanu Sood, Laboratory Director, CALCE, University of Maryland | |
Leo Lambert, Vice President, Technical Director, EPTAC Corporation |
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