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May 22, 2013
Soldering Multilayer Ceramic Chip Capacitor
Soldering Multilayer Ceramic Chip Capacitor
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Selective Soldering Technology Selection
Selective Soldering Technology Selection
Production Floor
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Analysis Lab
Nitrogen Inerting For Lead-Free Wave Soldering
Nitrogen Inerting For Lead-Free Wave Soldering
Production Floor
Gold Plated Hole Defects
Gold Plated Hole Defects
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Cold Solder Joints on 0603 Components
Cold Solder Joints on 0603 Components
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Insufficient Plated Hole Fill with Electrolytic Capacitors
Insufficient Plated Hole Fill with Electrolytic Capacitors
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Contract Assembly in a Prison
Contract Assembly in a Prison
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iNEMI Lead-free Wave Soldering Project
iNEMI Lead-free Wave Soldering Project
Production Floor
Does Flux Volume Impact Solderability?
Does Flux Volume Impact Solderability?
Board Talk
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Can Solder Joint Geometry Change Resistance?
Can Solder Joint Geometry Change Resistance?
Could solder joint volume, fillet profiles or flux residues result in solder joints with higher resistance and as a result draw more current?
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Expert Panel contributors for this topic:
Greg York, Technical Sales Manager, BLT Circuit Services Ltd
Terry Munson, President/Senior Technical Consultant, Foresite
Dr. Craig D. Hillman, CEO & Managing Partner, DfR Solutions
Michael Kirschner, President, Design Chain Associates, LLC
Christopher B Cain, R&D Manager, Agilent Technologies
Paul J. Koep, Global Product Manager, Alpha - Cookson Electronics
Doug Pauls, Principal Materials and Process Engineer, Rockwell Collins
Bob Lazzara, VP, Marketing & Tech Support, Circuit Connect, Inc.
Fritz Byle, Process Engineer, Astronautics
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