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The Knowledge and Know-how Connection
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May 22, 2013
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Reflow Causing Warp
We have a 20 layer PWB that bows during reflow. Other than a better design, what can be done prior to reflow, during reflow, or post reflow, to prevent the board from warping?
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Views: 1269
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You must run a thermal profile first to find where the temp differences are on the board. Warp is caused by temperature difference for the most part. This is difficult to solve sometimes because a reflow oven is designed the heat uniformly and your product is not so uniform. If the difference top to bottom, you can use your oven's top vs bottom settings to increase the temp on the cooler surface of the board. If side to side, you could try rotating the board 90 deg so the whole cooler side enters the oven at the same time. If only one smaller portion of the board is cooler, the best thing is to "shield" the hotter portion with a thin layer of insulation material, like PCB material cut to size so the board heats more evenly. In a sense, make up for the design deficiencies by adding or balancing the assembly's heating rate to make it more uniform.
Paul Austen, ECD