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The Knowledge and Know-how Connection
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May 24, 2013
Soldering Multilayer Ceramic Chip Capacitor
Soldering Multilayer Ceramic Chip Capacitor
Ask the Experts
Selective Soldering Technology Selection
Selective Soldering Technology Selection
Production Floor
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Analysis Lab
Nitrogen Inerting For Lead-Free Wave Soldering
Nitrogen Inerting For Lead-Free Wave Soldering
Production Floor
Gold Plated Hole Defects
Gold Plated Hole Defects
Ask the Experts
Cold Solder Joints on 0603 Components
Cold Solder Joints on 0603 Components
Ask the Experts
Insufficient Plated Hole Fill with Electrolytic Capacitors
Insufficient Plated Hole Fill with Electrolytic Capacitors
Ask the Experts
Contract Assembly in a Prison
Contract Assembly in a Prison
Ask the Experts
iNEMI Lead-free Wave Soldering Project
iNEMI Lead-free Wave Soldering Project
Production Floor
Does Flux Volume Impact Solderability?
Does Flux Volume Impact Solderability?
Board Talk
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Manncorp's MC-385 pick-and-place mounts 01005 chips, micro-BGAs and fine-pitch QFPs.
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Pad Cratering and Suggested Solutions
Pad Cratering and Suggested Solutions
Industry expert Bob Willis uses the NPL Defect Database to explain pad cratering, drop test failure and suggested solutions for pads and alloys.
Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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