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June 18, 2013
Pin in Paste Plus Preforms to Eliminate Wave Soldering
Pin in Paste Plus Preforms to Eliminate Wave Soldering
Production Floor
Components Lifting During Wave Soldering
Components Lifting During Wave Soldering
Ask the Experts
What Causes Blow Holes?
What Causes Blow Holes?
Board Talk
Toe Fillet Requirements on Gull Wing Components
Toe Fillet Requirements on Gull Wing Components
Ask the Experts
How To Eliminate PCB Bow and Twist
How To Eliminate PCB Bow and Twist
Production Floor
Why is Solder Dross Sticking to Our PCBAs?
Why is Solder Dross Sticking to Our PCBAs?
Board Talk
Soldering Multilayer Ceramic Chip Capacitor
Soldering Multilayer Ceramic Chip Capacitor
Ask the Experts
Selective Soldering Technology Selection
Selective Soldering Technology Selection
Production Floor
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Analysis Lab
Nitrogen Inerting For Lead-Free Wave Soldering
Nitrogen Inerting For Lead-Free Wave Soldering
Production Floor
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Cold Solder Joints on 0603 Components
Cold Solder Joints on 0603 Components
We encountered cold solder joints on 0603 components on a batch of assemblies, yet all larger components had good solder joints. Was the problem due to solder paste exceeding the 12 hour usage limit?
Expert Panel contributors for this topic:
Karthik Vijay, Technical Manager, European Operations, Indium Corp.
Brook Sandy, Product Support Specialist , Indium Corporation
Keshava Murthy, Process Engineer, Bosch Automotive Electronics India Ltd.
Edward Zamborsky, Regional Sales Manager, OK International Inc.
Greg York, Technical Sales Manager, BLT Circuit Services Ltd
Georgian Simion, Operations Manager - A&E, AWS, Projects Unlimited, Inc.
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