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December 16, 2014
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
What is Causing Intermittent BGA Failures?
What is Causing Intermittent BGA Failures?
Board Talk
Evaluating Accuracy of Thermocouple Attach Methods
Evaluating Accuracy of Thermocouple Attach Methods
Analysis Lab
Opens at BGA Component Corner Balls
Opens at BGA Component Corner Balls
Ask the Experts
Solderability Problems at Low Humidity
Solderability Problems at Low Humidity
Board Talk
Lead-Free Profile Using Leaded Paste
Lead-Free Profile Using Leaded Paste
Ask the Experts
Rechecking Thermal Profiles
Rechecking Thermal Profiles
Ask the Experts
Reflow Optimization for MLP Components
Reflow Optimization for MLP Components
Production Floor
Lead-free Reflow Oven Zone Count
Lead-free Reflow Oven Zone Count
Ask the Experts
Reflow For Rigid Flex
Reflow For Rigid Flex
Board Talk
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What Causes Solder Skips?
What Causes Solder Skips?
Bob Willis looks at the most common reasons for solder skips on surface mount during wave soldering and illustrates how pad length, mask thickness and gassing and flux will contribute to the problem.
Authored By:
Bob Willis - http://www.bobwillis.co.uk
Bob Willis operates a training and consultancy business based in England.
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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