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The Knowledge and Know-how Connection
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June 19, 2013
Ten Rules for Jumper Wires
Ten Rules for Jumper Wires
Production Floor
Overcoming Repair Depot Challenges
Overcoming Repair Depot Challenges
Production Floor
Jumper Wire Nightmare!
Jumper Wire Nightmare!
Production Floor
Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
Board Talk
Is There a Thermal Cycle Limit?
Is There a Thermal Cycle Limit?
Board Talk
Rework or Repair?
Rework or Repair?
Ask the Experts
What is the Reliability of Reballed BGAs?
What is the Reliability of Reballed BGAs?
Production Floor
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
Analysis Lab
BGA Site Modification - Is It Possible?
BGA Site Modification - Is It Possible?
Production Floor
BGA Rework Flux Recommendation
BGA Rework Flux Recommendation
Ask the Experts
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Consensus for Baking Prior to Rework?
Consensus for Baking Prior to Rework?
What is the industry consensus for baking out moisture in circuit board assemblies prior to convection rework, localized mini-wave rework, or hand soldering rework?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
Comments  » Submit a Comment  »


I cannot believe that people say to remove the components first, this is very time consuming. It is not necessary, you can dry them fast in a 60C 1%RH low Humidity cabinet, without causing any oxidization and wettability problems.

Jos Brehler, Totech EU BV, Netherlands



Your program did not address the issue of whether or not baking is required. It referred to the IPC spec and stopped there. In order to make your programs more valuable to the listeners you should be talking about case studies and the like.

Tim Bibens, Surmotech



Dry your boards, otherwise they'll develop local de-lams ("Measles") under clumsy point heating. Measles are non-repairable. Well-dried boards are much more robust to sequences and processes of rework and special soldering ops. Wet boards will cause all sorts of mischief. Bake-out under nitrogen if you have vulnerable pad finishes. Store in dry cabinets, in-process.

Tom Clifford. TJB Associates

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