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May 21, 2012
TSOP Component Soldering Problems
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Printing Focused on Useful Technology
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The Asys Group provides EKRA screen printing solutions for the SMT, Hybrid, Semiconductor Packaging, and Solar industries.
EKRA

Max Interval Between Reflow for OSP Boards
Max Interval Between Reflow for OSP Boards
With OSP coated circuit boards, what is the maximum allowable and recommend time interval between reflow of the first and second sides to insure proper wetting.
This program first published February 2012
Board Talk programs are presented by:

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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