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February 22, 2012
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Failure Mechanism in Embedded Capacitors
Reliability of Coated WLCSP Components
Lifted Leads on QFP Components
Max Interval Between Reflow for OSP Boards
Printable Materials for Electronic Packaging
Flex Made Simple: IPC-2223 Includes Tutorial
IPC-2223, the standard for flex boards, includes a tutorial and information on new technologies like adhesiveless materials.
IPC — Association Connecting Electronics Industries
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Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
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