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February 22, 2012
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Failure Mechanism in Embedded Capacitors
Reliability of Coated WLCSP Components
Lifted Leads on QFP Components
Max Interval Between Reflow for OSP Boards
Printable Materials for Electronic Packaging
Ramping Up Preparations for Pending Conflict Minerals Regulation
IPC staff will provide updates and briefings on conflict minerals regulations at IPC APEX EXPO.
IPC — Association Connecting Electronics Industries
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Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
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