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A Century of Global Soldering Leadership
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LGA/QFN Packages Floating During Reflow
Industry expert Bob Willis explains why LGA/QFN packages may float during reflow and how this defect may be associated with excess voids and open solder joints.
Authored By:
Bob Willis
www.BobWillisOnline.com
Analysis Lab programs cover topics including:
Corrosion, Contamination, Data Acquisition, ESD and EOS, Inspection, Measurement, Profiling, Reliability, R&D, RFID, Solder Defects, Test, Tombstoning, X-ray and more.
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The Ideal Tool for Precision Circuit Board Work
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Most Energy Efficient Inspection Lighting
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NexJet™ features the one-piece, Genius™ Jet Cartridge. Built-in memory records jetting data and software controls the jetting process. Learn more...
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