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May 21, 2012
BGA Rework Flux Recommendation
Ask the Experts
SMT Components Popping Off During Reflow
Board Talk
Rework or Repair?
Ask the Experts
Rules for Reusing Electronic Components
Board Talk
Alternative to Dead Bug Rework
Production Floor
Consensus for Baking Prior to Rework?
Board Talk
Dip Solder Paste for BGA Rework
Production Floor
Is Pre-Bake Standard for Rework?
Ask the Experts
Can We Skip Cleaning After Rework?
Board Talk
Reliability Assessment of Reballed BGAs
Analysis Lab
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6 Common Mistakes of BGA Rework
6 Common Mistakes of BGA Rework
Ball Grid Array rework is one of the most challenging procedures performed at assembly facilities and repair depots. Let's look at the 6 most common mistakes in BGA rework and how you can avoid them.
Authored By:
Andy Price, National Sales Manager
Peter Vigneau, Vice President
Circuit Technology Center, Inc.
Haverhill, MA USA
This program first published January 2012
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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6 Common Mistakes of BGA Rework

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