IPC OUTLOOK Logo
The Knowledge and Know-how Connection
Loading
IPC OUTLOOK Logo
February 22, 2012
Programs  »
Failure Mechanism in Embedded Capacitors
Reliability of Coated WLCSP Components
Lifted Leads on QFP Components
Max Interval Between Reflow for OSP Boards
Printable Materials for Electronic Packaging
Welcome to IPC Outlook
Welcome to IPC Outlook - an electronic newsletter and website for multimedia information about technology, standards, best practices and industry trends.

We asked the industry what they wanted to see from IPC and we listened to what you said! IPC Outlook has been created to bring you helpful information on technology, standards, best practices and management trends on a weekly basis. All of the articles will be archived on www.IPCOutlook.org.

The left column will always show you the latest news from IPC. Feature articles in the second and third columns are categorized under "Programs" and will cover different types of articles from "Ask the Experts" to multimedia presentations of technical papers. Under "Channels," you'll be able to browse by type of technology from materials and board fabrication through electronics manufacturing. The "Directory" includes valuable information on hundreds of industry suppliers.

IPC is your industry association. We want to show you the value we can bring to you and your company in a timely and dynamic format.

We look forward to hearing from you about this new newsletter. Please let us know how we can continue to improve.

Thank you.

Kim Sterling, IPC Vice President of Marketing & Communications

IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Kim Sterling, Publisher
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships

490