IPC OUTLOOK Logo
The Knowledge and Know-how Connection
IPC OUTLOOK Logo
May 22, 2013
***image1**2Best Method for Repairing Underfill Arrays?
Board Talk
Jumper Wire Nightmare!
Jumper Wire Nightmare!
Production Floor
Is There a Thermal Cycle Limit?
Is There a Thermal Cycle Limit?
Board Talk
Rework or Repair?
Rework or Repair?
Ask the Experts
What is the Reliability of Reballed BGAs?
What is the Reliability of Reballed BGAs?
Production Floor
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
Analysis Lab
BGA Site Modification - Is It Possible?
BGA Site Modification - Is It Possible?
Production Floor
BGA Rework Flux Recommendation
BGA Rework Flux Recommendation
Ask the Experts
Advanced Rework Technology for Large Area Arrays
Advanced Rework Technology for Large Area Arrays
Production Floor
BGA Reballing and Influence on Ball Shear Strength
BGA Reballing and Influence on Ball Shear Strength
Analysis Lab
More Related Programs  »
Featured Sponsor - please stay tuned ...   »
Video X-ray During BGA Reflow
Video X-ray During BGA Reflow
Only Glenbrook's high resolution fluoroscopic x-ray imaging technology could produce this extraordinary video. Check it out.
Glenbrook Technologies

Is Rework Unacceptable?
Is Rework Unacceptable?
We have a customer who insists that assemblies should not be reworked. They will not accept boards which have been reworked. Is this practical?
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

Ask the Experts Questions | Ask the Experts Panel
Submit A Questions | Join the Panel
Expert Panel contributors for this topic:
Karthik Vijay, Technical Manager, European Operations, Indium Corp.
Jim Williams, Chairman, Polyonics, Inc.
Sjef van Gastel, Manager Advanced Development, Assembleon
Don Naugler, General Manager, VJ Technologies, Inc.
Allen W. Duck, CEO, ATEK llc
Brian Smith, General Manager - Electronic Assembly Americas, DEK International
Scott Wischoffer, Marketing Manager, Fuji America Corporation
Doug Dixon, Global Marketing Director, Henkel Electronics
Richard D. Stadem, Advanced Engineer/Scientist, General Dynamics
John Vivari, Application Engineering Supervisor, Nordson EFD
Comments  » Submit a Comment  »


I agree with Mr. Vivari that it's of a great importance to know why the customer has such a demand of no reworked PCB's accepted. Most important to me should be the amount of rework in ppm and the knowledge of the most common failures detected. I didn't read the option that may be the customer is forcing it's supplier to improve his processes due to a failure rate easy to be prevented. Besides that I don't believe a customer will pay for this rework so costs saving is no reason to my opinion.

Friso Tonnet, ECS Electronics BV, The Netherlands

Sponsors   »
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships
Programs: 900+  |  Directory Listings: 1450+  |  IPC Members: 3100+
Subscribers: 100,000+


Views: 1239