The Knowledge and Know-how Connection
May 21, 2013
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Mysteries of Science
Solder Paste Printing
Rework, Repair and Modification
Breakthroughs, Trends, Predictions
Solders, Fluxes and Pastes
Electronics Assembly Cleaning
Adhesives, Coating, Dispensing
Assembly, Printing, Pick & Place
Baking, Ovens, Moisture Control
Cleaning, Washing, Solvents
Contamination, Defects, Whiskers
Environment, RoHS, Recycling
Flip-Chip, MEMS, Semiconductors
Operations, Productivity, Supply
PC Fab, Board Design, Laminates
Reflow Soldering, Profiling
Rework, Repair, Modification
Soldering, Selective, Wave
Solders, Fluxes, Pastes
Test, Inspection, X-Ray
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Solder Paste Ingredients vs. Performance
3 Steps To Solder Paste Selection
Low-Silver BGA Assembly
VOC Free Flux Study
Developing a New Lead-Free Alloy
Pb-Free Alloy Alternatives
Activator Technology for Lead-Free Paste
Second Generation Pb-Free Alloys
Pb-free Solder Joint Reliability
Enhancing Reliability of PB-Free Solder Joints
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Channel: Solders, Fluxes, Pastes
Submit a Comment
Great topic, been there a few too many times. I agree with not re-performing every test and trusting your vendor testing. I would only add that IPC-TM-650 TEST METHODS MANUAL remains a good reference, and I continue to perform these test but as you mention, perform these in your production environment. Also I would add to pay close attention to board cleanliness between the paste/flux samples, when newer BTC type components are used. Cheers!
Jeff Hempton, BAE Systems, USA
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Sandy Gentry, Editor | Neal Bender, Membership Director
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