The Knowledge and Know-how Connection
June 18, 2013
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Mysteries of Science
Solder Paste Printing
Rework, Repair and Modification
Breakthroughs, Trends, Predictions
Solders, Fluxes and Pastes
Electronics Assembly Cleaning
Adhesives, Coating, Dispensing
Assembly, Printing, Pick & Place
Baking, Ovens, Moisture Control
Cleaning, Washing, Solvents
Contamination, Defects, Whiskers
Environment, RoHS, Recycling
Flip-Chip, MEMS, Semiconductors
Operations, Productivity, Supply
PC Fab, Board Design, Laminates
Reflow Soldering, Profiling
Rework, Repair, Modification
Soldering, Selective, Wave
Solders, Fluxes, Pastes
Test, Inspection, X-Ray
IPC Outlook Directory
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Overcoming Challenges to Functional Test
Virtual Access Augments Test Coverage
Voiding Control at QFN Assembly
Integrated Electrical Test Within the Production Line
X-rays vs. Cross Sections to Measure Voids
Fatigue Behaviour of Reflowed Joints
Evaluating Surface Cleanliness
Boundary Scan Advanced Diagnostic Methods
Pb-Free Thermal Cycle Acceleration Factors
Revolutionary Technique for Microvia Microsections
More Related Programs
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Solder Residues and In-Circuit Test
While running a solder paste comparison through our ICT process, we found one solder paste residue is harder than another. What could be causing the difference?
Program: Board Talk
Channel: Test, Inspection, X-Ray
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