Question for you...

What type of power do you have? Single or three phase?

Do you see your volume growing or PCB increasing in complexity?

I think your answer somewhere between quality and throughput. Assuming the quality is the same then can you get the throughput.

If the answer is yes then what do you think your throughput will be in a years time, best to plan ahead.

Also how much time do you have to put people on loading and unloading?

Having supported both types of ovens; my recommendation would be the conveyor oven.

The batch may be fine for your current capabilities, but as your volumes increase the conveyor oven will provide the additional thru-put you will need to meet those volumes.

In addition, it will provide the necessary experience that you will need when you grow into an even larger system.

Assuming that all things are equal, which would be the better option, a conveyor type oven or a batch type?

A couple of points to consider:

1. Throughput
2. Maximum temperature rating of the batch vs. reflow
3. Heating Technology used
4. How is the heat directed or disbursed in the chamber or chambers
   Uniform heating across your board
5. Controller being used and how used
   Stable gradient of temperature
   Batch: Chamber changes temperature - board static
   Conveyor: Chambers temperature static(fixed) - board dynamic
6. Run samples with a profiler and compare.
7. http://www.apsgold.com/learning/reflow

The real concerns here are the heating types, and work flows.

• What type of heating does it use IR, convection, or vapor phase?
• Are the ovens capable of heating your assemblies uniformly and within your solder pastes specifications?
• Is your manufacturing flow more conducive to a steady stream of products, or smaller batches.
• Does the batch workflow keep your assemblies within the specified work time?
• Is there room for production growth?

These are all questions that would need to be answered.

You select cleaning methods and solvent chemistry based on the flux chemistry used, right?

Likewise, you select soldering processes based on the physical characteristics and required quantities of the product (CCA). These requirements include the size of the assembly, the type of components, the quantities expected to be built during the depreciation period (you don't buy a new Cadillac to go for a single ride, do you?

Of course not, you take a cab or other means of transportation), the quality level required (a small batch or conveyor oven may work fine for small quantities of prototypes or pre-prod units, but for large production volumes a larger oven with better temperature controls is required).

There are many considerations when selecting the best reflow method or machine and whether to buy or contract out. For example, some parts can't be convection reflowed such as certain switches, connectors, etc.

Other components cannot be immersed in liquids or caustic chemicals (LEDs and LCDs for example) so vapor phase may not be an option. Some can't be soldered by anything except laser or perhaps a selective solder machine. So you need to understand what's best for your current product and near-future requirements and select accordingly.

Keep in mind that if you contract out, you lose some control over schedule flexibility and the ability to make in-process changes easily and cheaply.