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May 22, 2013
Cause of SMT Component Shift?
Cause of SMT Component Shift?
Ask the Experts
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
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What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
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Tombstoning Dilemma
Tombstoning Dilemma
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Adding Weights to Small BGAs During Reflow
Adding Weights to Small BGAs During Reflow
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Effect of Cooling Rate on the Intermetallic Solder Joints
Effect of Cooling Rate on the Intermetallic Solder Joints
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How to Re-Certify a Reflow Oven After Moving
How to Re-Certify a Reflow Oven After Moving
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Effects of Reflow and Flux on Tin Whiskers
Effects of Reflow and Flux on Tin Whiskers
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Why LGA/QFN Packages May Float During Reflow
Why LGA/QFN Packages May Float During Reflow
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Opens at BGA Component Corner Balls
Opens at BGA Component Corner Balls
We have been stumped by occasional opens at the corner balls of some BGA components after reflow. Do you have any suggestions?
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Leo Lambert, Vice President, Technical Director, EPTAC Corporation
Alan Cable, President, ACE Production Technologies
Steven Adamson, Market Specialist, Nordson ASYMTEK
Bill Coleman, Vice President Technology, Photo Stencil
Karl Seelig, Vice President of Technology, AIM
Richard Boyle, Global Product Champion, Henkel Electronics
Subrat Prajapati, Supplier Quality Leader, Ge Healthcare
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