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May 24, 2013
Soldering Multilayer Ceramic Chip Capacitor
Soldering Multilayer Ceramic Chip Capacitor
Ask the Experts
Selective Soldering Technology Selection
Selective Soldering Technology Selection
Production Floor
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Analysis Lab
Nitrogen Inerting For Lead-Free Wave Soldering
Nitrogen Inerting For Lead-Free Wave Soldering
Production Floor
Gold Plated Hole Defects
Gold Plated Hole Defects
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Cold Solder Joints on 0603 Components
Cold Solder Joints on 0603 Components
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Insufficient Plated Hole Fill with Electrolytic Capacitors
Insufficient Plated Hole Fill with Electrolytic Capacitors
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Contract Assembly in a Prison
Contract Assembly in a Prison
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iNEMI Lead-free Wave Soldering Project
iNEMI Lead-free Wave Soldering Project
Production Floor
Does Flux Volume Impact Solderability?
Does Flux Volume Impact Solderability?
Board Talk
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Accurate Force Measurement SolderabilityTesting
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Force measurement solderability testing verifies the robustness of the component or board termination. The Gen 3 Systems Must 3 measures forces at milli-newton levels accurately and easily.
Gen3 Systems Limited

When is it Time to Shift from Hand to Wave Soldering?
When is it Time to Shift from Hand to Wave Soldering?
We assemble simple through-hole circuit boards. What are the main factors to consider when shifting from hand soldering to wave soldering?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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