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May 24, 2013
Soldering Multilayer Ceramic Chip Capacitor
Soldering Multilayer Ceramic Chip Capacitor
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Selective Soldering Technology Selection
Selective Soldering Technology Selection
Production Floor
EOS Exposure of Components in the Soldering Process
EOS Exposure of Components in the Soldering Process
Analysis Lab
Nitrogen Inerting For Lead-Free Wave Soldering
Nitrogen Inerting For Lead-Free Wave Soldering
Production Floor
Gold Plated Hole Defects
Gold Plated Hole Defects
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Cold Solder Joints on 0603 Components
Cold Solder Joints on 0603 Components
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Insufficient Plated Hole Fill with Electrolytic Capacitors
Insufficient Plated Hole Fill with Electrolytic Capacitors
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Contract Assembly in a Prison
Contract Assembly in a Prison
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iNEMI Lead-free Wave Soldering Project
iNEMI Lead-free Wave Soldering Project
Production Floor
Does Flux Volume Impact Solderability?
Does Flux Volume Impact Solderability?
Board Talk
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iNEMI Lead-free Wave Soldering Project
iNEMI Lead-free Wave Soldering Project
Paper provides an understanding of how wave soldering parameters correlate to performance and provides information in selecting process parameters.
Authored By:
Denis Barbini - BCS, Nottingham, NH, USA
Denis Jean - Plexus, Inc., Neenah, WI, USA
Stuart Longgood - Delphi Corporation, Kokomo, IN, USA
Keith Howell - Nihon Superior, Cadmenton, MO, USA
Jian Miremadi - Hewlett-Packard Company, Palo Alto, CA, USA
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