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May 24, 2013
Cause of SMT Component Shift?
Cause of SMT Component Shift?
Ask the Experts
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
Board Talk
What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
Board Talk
Tombstoning Dilemma
Tombstoning Dilemma
Ask the Experts
Adding Weights to Small BGAs During Reflow
Adding Weights to Small BGAs During Reflow
Ask the Experts
Effect of Cooling Rate on the Intermetallic Solder Joints
Effect of Cooling Rate on the Intermetallic Solder Joints
Production Floor
How to Re-Certify a Reflow Oven After Moving
How to Re-Certify a Reflow Oven After Moving
Ask the Experts
Effects of Reflow and Flux on Tin Whiskers
Effects of Reflow and Flux on Tin Whiskers
Analysis Lab
Why LGA/QFN Packages May Float During Reflow
Why LGA/QFN Packages May Float During Reflow
Production Floor
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Lead-free Reflow Oven Zone Count
Lead-free Reflow Oven Zone Count
We have a 4-zone oven that is not rated for lead-free soldering and are in the process of replacing it. How many zones are necessary to do a good job?
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

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Expert Panel contributors for this topic:
Richard D. Stadem, Advanced Engineer/Scientist, General Dynamics
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
Brian O'Leary, General Manager, Trans-tec America LLC
Mark Waterman, Engineer / Trainer, Electronic Controls Design, Inc. (ECD)
Allen W. Duck, CEO, ATEK llc
Bjorn Dahle, President, KIC
Chris Ellis, Sales Manager, Manncorp
Steve Pollock, Vice President, Essemtec USA
Steven Adamson, Market Specialist, Nordson ASYMTEK
Neil Poole, Senior Applications Chemist, Henkel Electronics
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