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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
April 24, 2014
Stencil Design for Ultra Fine Pitch Printing
Stencil Design for Ultra Fine Pitch Printing
Production Floor
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
Materials Tech
How To Determine Stencil Thickness
How To Determine Stencil Thickness
Board Talk
Pick and Place Placement Rate
Pick and Place Placement Rate
Ask the Experts
Most Important Factors for Screen Printing
Most Important Factors for Screen Printing
Ask the Experts
Minimizing Voiding in QFN Packages
Minimizing Voiding in QFN Packages
Production Floor
Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
Production Floor
How to Clamp Odd Shaped Circuit Boards
How to Clamp Odd Shaped Circuit Boards
Ask the Experts
Components Near PCB Edges
Components Near PCB Edges
Board Talk
Low-Silver BGA Assembly
Low-Silver BGA Assembly
Production Floor
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New Metcal HCT2-120 Hot Air Pencil
New Metcal HCT2-120 Hot Air Pencil
The new Digital Hot Air Pencil is ideal for applications which use smaller components and allows more rework access without affecting adjacent parts.
OK International

How Do You Calculate Solder Paste Volume?
How Do You Calculate Solder Paste Volume?
How do you calculate the volume of solder paste needed for screen printing PCB assemblies? Is there a simple formula?
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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