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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
July 23, 2014
Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
Production Floor
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Production Floor
Type III vs. Type IV Solder Paste
Type III vs. Type IV Solder Paste
Ask the Experts
Screen Print Stepped Stencil Review
Screen Print Stepped Stencil Review
Board Talk
Effect of Nano-Coated Stencil on 01005 Printing
Effect of Nano-Coated Stencil on 01005 Printing
Production Floor
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Low Surface Energy Coatings Rewrite Area Ratio Rules
Low Surface Energy Coatings Rewrite Area Ratio Rules
Materials Tech
Printing vs. Dispensing
Printing vs. Dispensing
Board Talk
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
Quantifying Stencil Aperture Wall Quality
Quantifying Stencil Aperture Wall Quality
Analysis Lab
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Heller Wins Prestigious Vision Award
HELLER
The worldwide leader in reflow soldering ovens has won the prestigious S.M.T. Vision Award for reflow soldering technology advancement for the new Mark 5 convection soldering system.
Heller Industries Inc.

How Do You Calculate Solder Paste Volume?
How Do You Calculate Solder Paste Volume?
How do you calculate the volume of solder paste needed for screen printing PCB assemblies? Is there a simple formula?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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