IPC OUTLOOK Logo
The Knowledge and Know-how Connection
IPC OUTLOOK Logo
August 19, 2014
Suggested Stencil Wipe Frequency?
Suggested Stencil Wipe Frequency?
Board Talk
Assembly of POP with Novel Epoxy Flux on Solder Paste
Assembly of POP with Novel Epoxy Flux on Solder Paste
Production Floor
Printing and Assembly Challenges for QFN Devices
Printing and Assembly Challenges for QFN Devices
Production Floor
What is the Ideal Stencil Thickness?
What is the Ideal Stencil Thickness?
Board Talk
Enclosed Media Printing as an Alternative to Metal Blades
Enclosed Media Printing as an Alternative to Metal Blades
Production Floor
Big Ideas on Miniaturization
Big Ideas on Miniaturization
Production Floor
Fastening SMT Connectors - Before or After Refow?
Fastening SMT Connectors - Before or After Refow?
Ask the Experts
SAMP-Based Stencil Nano Coatings
SAMP-Based Stencil Nano Coatings
Analysis Lab
Profiled Squeegee Blade Review
Profiled Squeegee Blade Review
Production Floor
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Print Performance Studies Comparing Electroform and Laser-Cut Stencils
Production Floor
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How Do You Calculate Solder Paste Volume?
How Do You Calculate Solder Paste Volume?
How do you calculate the volume of solder paste needed for screen printing PCB assemblies? Is there a simple formula?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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