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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
April 18, 2014
Most Important Factors for Screen Printing
Most Important Factors for Screen Printing
Ask the Experts
Minimizing Voiding in QFN Packages
Minimizing Voiding in QFN Packages
Production Floor
Stencil Printing Yield Improvements
Stencil Printing Yield Improvements
Production Floor
How to Clamp Odd Shaped Circuit Boards
How to Clamp Odd Shaped Circuit Boards
Ask the Experts
Components Near PCB Edges
Components Near PCB Edges
Board Talk
Low-Silver BGA Assembly
Low-Silver BGA Assembly
Production Floor
Controlling the Assembly Process Using SPC
Controlling the Assembly Process Using SPC
Supply Chain
Larger Stencil Apertures and Type 4 Paste
Larger Stencil Apertures and Type 4 Paste
Board Talk
Choosing the Right Stencil Options
Choosing the Right Stencil Options
Production Floor
Chip Component Cracking During Pick/Place
Chip Component Cracking During Pick/Place
Board Talk
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Indium Corporation SACM™ Soldering Alloy
Indium Corporation SACM™ Soldering Alloy
SACM™ solder alloy offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling.
Indium Corporation

How Do You Calculate Solder Paste Volume?
How Do You Calculate Solder Paste Volume?
How do you calculate the volume of solder paste needed for screen printing PCB assemblies? Is there a simple formula?
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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