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November 25, 2014
Solder Paste Stencil Design for Optimal QFN Reliability
Solder Paste Stencil Design for Optimal QFN Reliability
Production Floor
Screen Print Shelf Life
Screen Print Shelf Life
Ask the Experts
Nano Tech Improves Critical Printing Process
Nano Tech Improves Critical Printing Process
Production Floor
Solder Paste Print Volume vs. Alignment?
Solder Paste Print Volume vs. Alignment?
Board Talk
Reliability Study of Bottom Terminated Components
Reliability Study of Bottom Terminated Components
Analysis Lab
Advanced Printing for Microelectronic Packaging
Advanced Printing for Microelectronic Packaging
Production Floor
What Is Causing Sticky Stencil Blades?
What Is Causing Sticky Stencil Blades?
Ask the Experts
Printing of Solder Paste - A Quality Assurance Methodology
Printing of Solder Paste - A Quality Assurance Methodology
Production Floor
Solder Paste and the 5 Ball Rule
Solder Paste and the 5 Ball Rule
Board Talk
Solder Paste Transfer Efficiency - What/Why
Solder Paste Transfer Efficiency - What/Why
Board Talk
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How Do You Calculate Solder Paste Volume?
How Do You Calculate Solder Paste Volume?
How do you calculate the volume of solder paste needed for screen printing PCB assemblies? Is there a simple formula?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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