Humidity in an electronics can wreak havoc on components. FREE guide helps you avoid ESD-and MSD-related defects and introduces a brand new solution. ECD
Master Bond MasterSil 151 is a two part silicone for potting and encapsulation. It maintains remarkable flexibility and high temperature resistance. Master Bond Inc.
Divisio from the ASYS Group provides a complete line of depaneling solutions. From compact standalone systems to fully automatic in-line solutions - configured to match your application. ASYS Group Americas Inc.
Blackfox's Lead Free Soldering minimizes the risks of conversion, when introducing lead free products and processes. The lead free certification program incorporates the latest IPC requirements. Learn more... Blackfox Training Institute
IPC — Association Connecting Electronics Industries 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director
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