The Knowledge and Know-how Connection
May 22, 2013
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Mysteries of Science
Solder Paste Printing
Rework, Repair and Modification
Breakthroughs, Trends, Predictions
Solders, Fluxes and Pastes
Electronics Assembly Cleaning
Adhesives, Coating, Dispensing
Assembly, Printing, Pick & Place
Baking, Ovens, Moisture Control
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Contamination, Defects, Whiskers
Environment, RoHS, Recycling
Flip-Chip, MEMS, Semiconductors
Operations, Productivity, Supply
PC Fab, Board Design, Laminates
Reflow Soldering, Profiling
Rework, Repair, Modification
Soldering, Selective, Wave
Solders, Fluxes, Pastes
Test, Inspection, X-Ray
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Voiding Control at QFN Assembly
Integrated Electrical Test Within the Production Line
X-rays vs. Cross Sections to Measure Voids
Fatigue Behaviour of Reflowed Joints
Evaluating Surface Cleanliness
Boundary Scan Advanced Diagnostic Methods
Pb-Free Thermal Cycle Acceleration Factors
Revolutionary Technique for Microvia Microsections
Explanation of PoP Inspection Techniques
Drop Test Performance of BGA Assemblies
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ASYS - Transforming Ideas Into Solutions!
The ASYS Group is a leading manufacturer of process & handling systems for the electronics and photovoltaic industries.
ASYS Group Americas Inc.
NASA Lead-Free Project: Mechanical Shock Test
Paper covers mechanical shock testing conducted by Boeing Research and Technology for the NASA-DoD Lead-Free Electronics Solder Project.
Program: Analysis Lab
Channel: Test, Inspection, X-Ray
Thomas A. Woodrow, Ph.D.
Boeing Research and Technology
Seattle, WA USA
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A World of Selective Soldering Solutions
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Getting Soaked by Humidity Issues?
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The Ideal Tool for Precision Circuit Board Work
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IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director
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