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Reflow Optimization for MLP Components
Paper covers 6 sigma methodology for developing a design of experiments to determine the best process for mounting 6x6 DrMOS Molded Lead Package components.
Authored By:
Dennis Lang
Fairchild Semiconductor
San Jose, CA USA
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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