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May 22, 2013
Cause of SMT Component Shift?
Cause of SMT Component Shift?
Ask the Experts
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
Board Talk
What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
Board Talk
Tombstoning Dilemma
Tombstoning Dilemma
Ask the Experts
Adding Weights to Small BGAs During Reflow
Adding Weights to Small BGAs During Reflow
Ask the Experts
Effect of Cooling Rate on the Intermetallic Solder Joints
Effect of Cooling Rate on the Intermetallic Solder Joints
Production Floor
How to Re-Certify a Reflow Oven After Moving
How to Re-Certify a Reflow Oven After Moving
Ask the Experts
Effects of Reflow and Flux on Tin Whiskers
Effects of Reflow and Flux on Tin Whiskers
Analysis Lab
Why LGA/QFN Packages May Float During Reflow
Why LGA/QFN Packages May Float During Reflow
Production Floor
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TSOP Component Soldering Problems
TSOP Component Soldering Problems
I supervise no-clean, lead-free SMT lines in an area with no control over humidity. We are seeing a high fallout due to insufficient paste application on TSOP components. Help!
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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