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The Knowledge and Know-how Connection
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June 19, 2013
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Views: 2512
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Hopefully Hector's comments were helpfull. If not, the first thing that occured to my mind, was: "what about trapped air in plugged via's located below the components, that are popping off? Of course in that case we are dealing with a raw print malfunction.
Torben Norlyk, Technician, Manufacturing Engineering, Integrated Defense and Security Systems
When I started at our current employer we had similar issues and thought the same thing, our oven did not have the variable fan speed settings option. With the help of an oven profiler (thermocouples) that we later acquired we found via the profiler temperature graphs that we where ramping up to temperature too quickly and this rapid temperature increase created excessive out gassing and therefore a popcorn effect. Parts where being blown off during this rapid out gassing.
With the help of the oven profiler we where able to fine tune profiles to our solder, board density and thickness. The problem went away. I'd recommend you start with verifying that your oven parameters coincide with the recommended temperature graph as suggested by the manufacturer of solder paste and attempt to mimic those settings. Process of elimination start there. Hopefully handling issues associated with moisture control are taking place, if not, correct handling issues.
Hector A. Maldonado, Manufacturing Process Control, Teletronics Technology Corporation