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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
November 26, 2014
Burned Chip Repair
Burned Chip Repair
Ask the Experts
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
Analysis Lab
Rework of Large Surface Mount Connectors
Rework of Large Surface Mount Connectors
Production Floor
Cleaning Reballed BGA Components
Cleaning Reballed BGA Components
Board Talk
Rework Challenges for Smart Phones and Tablets
Rework Challenges for Smart Phones and Tablets
Production Floor
Reworking Circuits Under a BGA Component
Reworking Circuits Under a BGA Component
Ask the Experts
Through-Hole Rework for Challenging Components
Through-Hole Rework for Challenging Components
Production Floor
A Case of Missing SMT Pads
A Case of Missing SMT Pads
Production Floor
Time Required to Bake for Repair
Time Required to Bake for Repair
Ask the Experts
Is There a Thermal Cycle Limit?
Is There a Thermal Cycle Limit?
Board Talk
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Rules for Reusing Electronic Components
Rules for Reusing Electronic Components
If you remove a component from a circuit board, and the component is functional and not physically damaged, can it be reused on another circuit board?
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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