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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
October 23, 2014
Through-Hole Rework for Challenging Components
Through-Hole Rework for Challenging Components
Production Floor
A Case of Missing SMT Pads
A Case of Missing SMT Pads
Production Floor
Time Required to Bake for Repair
Time Required to Bake for Repair
Ask the Experts
Is There a Thermal Cycle Limit?
Is There a Thermal Cycle Limit?
Board Talk
Are Your BGA Operators Competent?
Are Your BGA Operators Competent?
Production Floor
Mixing Silicone and Acrylic Conformal Coatings
Mixing Silicone and Acrylic Conformal Coatings
Ask the Experts
High Lead Count SMT Connector Rework
High Lead Count SMT Connector Rework
Production Floor
Tips for Rework of  Large Scale BGA Components
Tips for Rework of Large Scale BGA Components
Production Floor
Rework for OSP Assemblies
Rework for OSP Assemblies
Ask the Experts
Delamination Causing Scrap
Delamination Causing Scrap
Ask the Experts
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Rules for Reusing Electronic Components
Rules for Reusing Electronic Components
If you remove a component from a circuit board, and the component is functional and not physically damaged, can it be reused on another circuit board?
ITM Consulting
Board Talk is presented by ITM Consulting

Visit ITM Consulting to learn more.

Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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