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The Knowledge and Know-how Connection
IPC OUTLOOK Logo
April 24, 2014
Reliability Assessment of Reballed BGAs
Reliability Assessment of Reballed BGAs
Analysis Lab
Process Control and Reliability of Reworked BGAs
Process Control and Reliability of Reworked BGAs
Production Floor
Is Pre-Bake Standard for Rework?
Is Pre-Bake Standard for Rework?
Ask the Experts
Cleaning for Reliability After QFN Rework
Cleaning for Reliability After QFN Rework
Production Floor
Is There a BGA Replacement Limit?
Is There a BGA Replacement Limit?
Ask the Experts
Solder Balls During Rework
Solder Balls During Rework
Ask the Experts
BGA Re-balling from Lead-free to Tin-lead
BGA Re-balling from Lead-free to Tin-lead
Production Floor
Alternative to Dead Bug Rework
Alternative to Dead Bug Rework
Production Floor
SMT Components Popping Off During Reflow
SMT Components Popping Off During Reflow
Board Talk
Rules for Reusing Electronic Components
Rules for Reusing Electronic Components
Board Talk
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Rules for Reusing Electronic Components
Rules for Reusing Electronic Components
If you remove a component from a circuit board, and the component is functional and not physically damaged, can it be reused on another circuit board?
ITM Consulting
Board Talk is presented by ITM Consulting

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Phil Zarrow
Phil Zarrow, ITM Consulting
With over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes.

Jim Hall
Jim Hall, ITM Consulting
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
 
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