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May 21, 2013
Cause of SMT Component Shift?
Cause of SMT Component Shift?
Ask the Experts
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
Board Talk
What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
Board Talk
Tombstoning Dilemma
Tombstoning Dilemma
Ask the Experts
Adding Weights to Small BGAs During Reflow
Adding Weights to Small BGAs During Reflow
Ask the Experts
Effect of Cooling Rate on the Intermetallic Solder Joints
Effect of Cooling Rate on the Intermetallic Solder Joints
Production Floor
How to Re-Certify a Reflow Oven After Moving
How to Re-Certify a Reflow Oven After Moving
Ask the Experts
Effects of Reflow and Flux on Tin Whiskers
Effects of Reflow and Flux on Tin Whiskers
Analysis Lab
Why LGA/QFN Packages May Float During Reflow
Why LGA/QFN Packages May Float During Reflow
Production Floor
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Vapour Phase - Profiling for Lead-Free Alloys
Vapour Phase - Profiling for Lead-Free Alloys
This paper covers the profiling gap with new thermal control techniques to address the issue of profiles meeting paste manufacturer recommendations.
Authored By:
Allen Duck
A-Tek LLC, Berthoud, CO, USA

Claus Zabel
Asscon Systemtechnik
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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