IPC OUTLOOK Logo
The Knowledge and Know-how Connection
IPC OUTLOOK Logo
June 18, 2013
A Generic Reflow Profile
A Generic Reflow Profile
Ask the Experts
Help With Defective Solder Joints
Help With Defective Solder Joints
Board Talk
Reflow Rigid Flex
Reflow Rigid Flex
Board Talk
Reflow Causing Warp
Reflow Causing Warp
Ask the Experts
Cause of SMT Component Shift?
Cause of SMT Component Shift?
Ask the Experts
Best Practices - Reflow Profiling for Lead-free
Best Practices - Reflow Profiling for Lead-free
Analysis Lab
Random Lifted Leads on QFP Components
Random Lifted Leads on QFP Components
Board Talk
What is the Life Span of a Profile Board?
What is the Life Span of a Profile Board?
Board Talk
Tombstoning Dilemma
Tombstoning Dilemma
Ask the Experts
Adding Weights to Small BGAs During Reflow
Adding Weights to Small BGAs During Reflow
Ask the Experts
More Related Programs  »
Featured Sponsor - please stay tuned ...   »
Counterfeit Component Certification
Counterfeit Component Certification
Get the latest training on dealing with and detecting counterfeit components in your supply chain or manufacturing environment. Learn more about this new certification.
EPTAC Corporation

Lead-Free Profile Using Leaded Paste
Lead-Free Profile Using Leaded Paste
We are considering using leaded solder paste while using an existing lead free reflow profile. Do you know if this has been successfully done and is it a reliable soldering method?
At "Ask the Experts" we submit challenging questions to our panel of distinguished experts. You provide the questions and they provide the answers.

Ask the Experts Questions | Ask the Experts Panel
Submit A Questions | Join the Panel
Expert Panel contributors for this topic:
Paul Austen, Senior Project Engineer, Electronic Controls Design Inc
Allen W. Duck, CEO, ATEK llc
Karthik Vijay, Technical Manager, European Operations, Indium Corp.
Brian O'Leary, General Manager, Trans-tec America LLC
Comments  » Submit a Comment  »


I would highly suggest not to use you lead-free profile to run you leaded paste. There is melting temp difference between to two products. Profiling your boards correctly is one of the most important processes to perform proper reflow.

You should profile each different board that you reflow because there is a differences depending on board population, thickness and ground plans which effect your reflow process.


Joe Mekus, M.C. Miller Co.

Sponsors   »
IPC OUTLOOK Logo IPC — Association Connecting Electronics Industries
3000 Lakeside Drive, 309 S, Bannockburn, IL 60015
Phone: 978-478-5112 | Fax: 843-682-4255
Sandy Gentry, Editor | Neal Bender, Membership Director
About IPC Outlook  |  Contact Us  |  Privacy Policy  |  Terms of Use  |  Sponsorships
Programs: 900+  |  Directory Listings: 1450+  |  IPC Members: 3100+
Subscribers: 100,000+


Views: 2194