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The Knowledge and Know-how Connection
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June 19, 2013
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Board Deflection During Pick & Place
We notice deflection in the 8x8 inch panel being populated. Will this deflection cause components to sit higher on the paste and thus have a slightly higher solder joint height?
Board Talk is presented by ITM ConsultingVisit ITM Consulting to learn more.Phil Zarrow, ITM ConsultingWith over 35 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis. He has vast experience in SMT equipment, materials and processes. Jim Hall, ITM ConsultingA Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics. He is a pioneer in the science of reflow.
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There are exceptions, but in general, the final height of the soldered component is largely controlled by wetting and buoyancy forces while the solder is molten. Therefore, deflection of the board during component placement should cause little or no variation in soldered component height. In fact board deflection may help to compensate for excessive placement force by lowering the impact force on the component during placement.
Tom Salzer
Automatic support tooling may be a good solution for you. This type of tooling conforms to the bottom-side, components and all, and supports the board during placement (and printing). With no programming required, it could be an easy implementation to solve your problem.
Jim Bernhard, Quik-tool, LLC