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August 22, 2014
Mechanical Behavior of Bi-Containing Pb-Frees
Mechanical Behavior of Bi-Containing Pb-Frees
Analysis Lab
NanoCopper Based Solder-free Electronic Assembly
NanoCopper Based Solder-free Electronic Assembly
Materials Tech
VOC Free Flux Study
VOC Free Flux Study
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Screening of Lower Melting Point Pb-Free Alloys
Screening of Lower Melting Point Pb-Free Alloys
Materials Tech
Rosin Flux or Water Soluble - Which To Use?
Rosin Flux or Water Soluble - Which To Use?
Board Talk
Solder Fortification with Preforms
Solder Fortification with Preforms
Materials Tech
Effect of Reflow Profiling on Solder Paste Flux Residues
Effect of Reflow Profiling on Solder Paste Flux Residues
Production Floor
Solder Paste Alloy Check
Solder Paste Alloy Check
Ask the Experts
Does Lead-free Flux Make a Difference?
Does Lead-free Flux Make a Difference?
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Pb-free Solder Joint Reliability
Pb-free Solder Joint Reliability
Analysis Lab
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Second Generation Pb-Free Alloys
Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents data for various new alloys which show promise as replacement materials.
Authored By:
Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D.
DfR Solutions, College Park, MD, USA
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Abstract
This paper will discuss the shortcomings of current LF alloys (namely SAC305) and present recent data for various new alloys which show promise as replacement materials. These newer alloys offer important reliability improvements but do have some issue that need resolution before mass implementation. Shock and vibration data will be provided, as well as thermal cycle data. The primary focus will be on SnCuNi and SAC105X alloys and how they can be used effectively in the Pb-free electronics industry going forward.
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