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Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents data for various new alloys which show promise as replacement materials.
Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D.
DfR Solutions, College Park, MD, USA
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
This paper will discuss the shortcomings of current LF alloys (namely SAC305) and present recent data for various new alloys which show promise as replacement materials. These newer alloys offer important reliability improvements but do have some issue that need resolution before mass implementation. Shock and vibration data will be provided, as well as thermal cycle data. The primary focus will be on SnCuNi and SAC105X alloys and how they can be used effectively in the Pb-free electronics industry going forward.
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