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July 22, 2014
Effect of Reflow Profiling on Solder Paste Flux Residues
Effect of Reflow Profiling on Solder Paste Flux Residues
Production Floor
Solder Paste Alloy Check
Solder Paste Alloy Check
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Does Lead-free Flux Make a Difference?
Does Lead-free Flux Make a Difference?
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Pb-free Solder Joint Reliability
Pb-free Solder Joint Reliability
Analysis Lab
Solder Paste Ingredients vs. Performance
Solder Paste Ingredients vs. Performance
Materials Tech
Comparison of SAC105 and SAC305 Solders
Comparison of SAC105 and SAC305 Solders
Materials Tech
Reusing Solder Paste Samples
Reusing Solder Paste Samples
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Pb-Free Alloy Alternatives
Pb-Free Alloy Alternatives
Materials Tech
Microstructure and Reliability of Low AG/Bi Solder Alloys
Microstructure and Reliability of Low AG/Bi Solder Alloys
Analysis Lab
The Digital Solder Paste
The Digital Solder Paste
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Second Generation Pb-Free Alloys
Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents data for various new alloys which show promise as replacement materials.
Authored By:
Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D.
DfR Solutions, College Park, MD, USA
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Abstract
This paper will discuss the shortcomings of current LF alloys (namely SAC305) and present recent data for various new alloys which show promise as replacement materials. These newer alloys offer important reliability improvements but do have some issue that need resolution before mass implementation. Shock and vibration data will be provided, as well as thermal cycle data. The primary focus will be on SnCuNi and SAC105X alloys and how they can be used effectively in the Pb-free electronics industry going forward.
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