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November 26, 2014
Solderability of Vapor vs. Convection Reflow
Solderability of Vapor vs. Convection Reflow
Materials Tech
Solder Paste Mixing After Cold Storage
Solder Paste Mixing After Cold Storage
Ask the Experts
Can You Mix Leaded and Lead-free?
Can You Mix Leaded and Lead-free?
Board Talk
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Microalloyed Sn-Cu Pb-Free Solder for High Temp
Materials Tech
Excess Flux Residue After Hand Soldering
Excess Flux Residue After Hand Soldering
Ask the Experts
Reliability of No-clean and Water-soluble Solder Pastes
Reliability of No-clean and Water-soluble Solder Pastes
Analysis Lab
Grain Refinement for Improved Lead-Free Joint Reliability
Grain Refinement for Improved Lead-Free Joint Reliability
Analysis Lab
Alternatives to Solder in Packaging and Assembly
Alternatives to Solder in Packaging and Assembly
Materials Tech
Nano Silver Replacement for High Lead Solders
Nano Silver Replacement for High Lead Solders
Materials Tech
Activator Technology for Lead-Free Paste
Activator Technology for Lead-Free Paste
Materials Tech
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Second Generation Pb-Free Alloys
Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents data for various new alloys which show promise as replacement materials.
Authored By:
Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D.
DfR Solutions, College Park, MD, USA
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Abstract
This paper will discuss the shortcomings of current LF alloys (namely SAC305) and present recent data for various new alloys which show promise as replacement materials. These newer alloys offer important reliability improvements but do have some issue that need resolution before mass implementation. Shock and vibration data will be provided, as well as thermal cycle data. The primary focus will be on SnCuNi and SAC105X alloys and how they can be used effectively in the Pb-free electronics industry going forward.
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