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September 30, 2014
New Requirements for Sir Measurement
New Requirements for Sir Measurement
Analysis Lab
Mixing Different SAC305 Solders
Mixing Different SAC305 Solders
Ask the Experts
Solder Hardness Comparison
Solder Hardness Comparison
Ask the Experts
Testing Intermetallic Fragility
Testing Intermetallic Fragility
Analysis Lab
Evaluation of Lead-free Solder Pastes
Evaluation of Lead-free Solder Pastes
Materials Tech
Solder Paste Past Shelf Life
Solder Paste Past Shelf Life
Ask the Experts
Flux for Cleanable and No-Clean Solder Pastes
Flux for Cleanable and No-Clean Solder Pastes
Materials Tech
Low Cost Alternative to SAC Alloys
Low Cost Alternative to SAC Alloys
Materials Tech
Mechanical Behavior of Bi-Containing Pb-Frees
Mechanical Behavior of Bi-Containing Pb-Frees
Analysis Lab
NanoCopper Based Solder-free Electronic Assembly
NanoCopper Based Solder-free Electronic Assembly
Materials Tech
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Second Generation Pb-Free Alloys
Second Generation Pb-Free Alloys
Paper covers shortcomings of current alloys, namely SAC305, and presents data for various new alloys which show promise as replacement materials.
Authored By:
Randy Schueller, Ph.D., Nathan Blattau, Ph.D., Joelle Arnold, and Craig Hillman, Ph.D.
DfR Solutions, College Park, MD, USA
Materials Tech programs cover topics including:
Adhesives, Chemicals, Cleaning Solutions, Coatings, Components, Design, Embedded Technology, Fasteners, Finishes, Flex Circuits, Flip Chip, Fluxes, PC Fab, Solders, Solder Masks, Solder Paste and more.
Abstract
This paper will discuss the shortcomings of current LF alloys (namely SAC305) and present recent data for various new alloys which show promise as replacement materials. These newer alloys offer important reliability improvements but do have some issue that need resolution before mass implementation. Shock and vibration data will be provided, as well as thermal cycle data. The primary focus will be on SnCuNi and SAC105X alloys and how they can be used effectively in the Pb-free electronics industry going forward.
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