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June 19, 2013
Evaluation of Molded Flip-chip BGA Packages
Evaluation of Molded Flip-chip BGA Packages
Analysis Lab
Gold Stud Bump Flip Chip Attachment
Gold Stud Bump Flip Chip Attachment
Materials Tech
Challenges of Package on Package Devices
Challenges of Package on Package Devices
Materials Tech
Assembly of Fine Pitch PoP Components
Assembly of Fine Pitch PoP Components
Production Floor
Embedded Packaging Technologies
Embedded Packaging Technologies
Materials Tech
Solder Bumping for Flip Chip Technology
Solder Bumping for Flip Chip Technology
Materials Tech
Flip Chip Package Qualification
Flip Chip Package Qualification
Materials Tech
Investigation of Pad Cratering in Large Flip-Chip BGA
Investigation of Pad Cratering in Large Flip-Chip BGA
Analysis Lab
New Technologies for Ultra Thin Chips
New Technologies for Ultra Thin Chips
Materials Tech
No-Clean Flux Residue and Underfill Compatibility
No-Clean Flux Residue and Underfill Compatibility
Materials Tech
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From the Single Chip to Wafer Integration
From the Single Chip to Wafer Integration
The objective of this paper is to identify the various technological concepts and to give a focus on Chip in Wafer in Silicon technology.
Authored By:
Gilles Poupon, Jean Charles Souriau, Herve Boutry, Jean Brun, Nicolas Sillon
CEA-LETI Minatec, Grenoble, France
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