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The Knowledge and Know-how Connection
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June 18, 2013
Ten Rules for Jumper Wires
Ten Rules for Jumper Wires
Production Floor
Overcoming Repair Depot Challenges
Overcoming Repair Depot Challenges
Production Floor
Jumper Wire Nightmare!
Jumper Wire Nightmare!
Production Floor
Best Method for Repairing Underfill Arrays?
Best Method for Repairing Underfill Arrays?
Board Talk
Is There a Thermal Cycle Limit?
Is There a Thermal Cycle Limit?
Board Talk
Rework or Repair?
Rework or Repair?
Ask the Experts
What is the Reliability of Reballed BGAs?
What is the Reliability of Reballed BGAs?
Production Floor
Test Method to Characterize Pad Cratering
Test Method to Characterize Pad Cratering
Analysis Lab
BGA Site Modification - Is It Possible?
BGA Site Modification - Is It Possible?
Production Floor
BGA Rework Flux Recommendation
BGA Rework Flux Recommendation
Ask the Experts
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High Lead Count SMT Connector Rework
High Lead Count SMT Connector Rework
This paper will examine the difficulties of reworking a very high thermal mass, high density, 5040 lead count surface mount connector.
Authored By:
Jim Bielick, Brian Chapman, Mitchell Ferrill
Michael Fisher, Phil Isaacs, Eddie Kobeda, Theron Lewis
IBM
Production Floor programs cover topics including:
CAD/CAM/CIM/EDA, Circuit Board Handling, Clean Room, Cleaning Operations, Component Insertion, Component Prep, Dispensing, Feeders, Fume Extraction, Hand Tools, Labeling/Marking, Lasers, Material Handling, Odd Form, Ovens/Curing, Packaging, Stencil Printing, Repair/Rework, Soldering and more.
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