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May 22, 2013
Assembly Challenges of Bottom Terminated Components
Assembly Challenges of Bottom Terminated Components
Production Floor
Is De-paneling PCBs by Hand Acceptable?
Is De-paneling PCBs by Hand Acceptable?
Board Talk
Stencil Design Improves Drop Test Performance
Stencil Design Improves Drop Test Performance
Materials Tech
Assembly and Reliability Investigation of PoP
Assembly and Reliability Investigation of PoP
Materials Tech
Is There a Spacing Spec for SMD Components?
Is There a Spacing Spec for SMD Components?
Board Talk
How to Gauge Solder Paste Volume?
How to Gauge Solder Paste Volume?
Board Talk
Challenges for Step Stencil Printing
Challenges for Step Stencil Printing
Production Floor
PCB Assembly System Set-Up for PoP
PCB Assembly System Set-Up for PoP
Production Floor
Mixed Technology - Which First
Mixed Technology - Which First
Ask the Experts
Revolutionary Printing Solution for SMT Assembly
Revolutionary Printing Solution for SMT Assembly
Production Floor
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Guidelines for Pin-in-Paste
Guidelines for Pin-in-Paste
We've tried a combination of 150 micron thick stencil and 1.6 mm thick board, but it seems we never manage to get the right amount of solder into the hole.
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Expert Panel contributors for this topic:
Karthik Vijay, Technical Manager, European Operations, Indium Corp.
Bill Coleman, Vice President Technology, Photo Stencil
Karl Seelig, Vice President of Technology, AIM
Doug Dixon, Global Marketing Director, Henkel Electronics
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